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|  DSH 373
2 Z4 b4 c( z$ b% [* h* {* @
- y* L5 _7 X; a3 G | Humidity conditioning
( c2 |8 ^- i M# i% K | 2.9.1 and 2.9.2! K. B* u( T* S6 \+ k
| 60950(ed.3)
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Standard:
, a& |: g- z' p5 t fIEC60950, 3rd Ed.- Z) s' p R0 L; \; h
Sub clause:1 T9 o; K4 m3 z+ ^7 U. L5 e1 O) Y8 n
2.9.1 and 2.9.2( P0 @ P3 W! L7 x
Sheet n. 373
; ]! K1 T+ b) o1 n5 Z& vPage 1 (1)) K" U" A3 q) G9 T
Subject:# T/ h; R! E1 M# E% J1 o3 b
Humidity conditioning
; l1 B L) j6 N1 ?) A7 yKey words:& o* u) T$ S N: g" i
-Insulation
- B, C1 C" U7 H. p% v# U-Humidity8 Q9 s% O5 N4 G, O
Decision confirmed
9 W6 Y8 q) s% M) Eat CTL 38th meeting7 F0 N! F) `4 B9 X, Y
Question:
3 {- J4 o f0 Q! P; l9 }0 ]Sub-clause 2.9.1 specifies that " the component or subassembly" be subjected to the
V+ b8 R$ @1 dhumidity treatment of 2.9.2. Sub-clause 2.9.2 specifies that " during the conditioning the
$ T+ X6 d5 H6 w3 Mcomponent or subassembly is not energized".8 p! _2 @6 B$ c! G$ O% c
Can these requirements be interpreted in the way that only components and subassemblies9 S! K, a# x9 C
need to be subjected to the conditioning and not the equipment where these components1 E/ U5 F" K! D! `: h; e
and/or subassemblies are mounted?
; l( |5 Z( _* y! J# EDecision:) T% u( E# }. U1 V& [+ V# H
Yes.
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* x" v( k" n3 ` f$ B6 K- d ?9 V' t. I. x
6 ^5 n3 |3 ?8 { E# R5 @& N4 r4 W, n1 T
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发表于 2012-11-6 17:52
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