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0 N( L: ~8 t8 Z3 h% ?, J% U# HStandard:
/ e- L1 R* B$ OIEC60950, 3rd Ed.
% g! N8 B5 K$ \: }% [5 f: F; nSub clause:
, s% F2 x `) M6 D2 b! \2.9.1 and 2.9.2
7 g0 H& J! A* h4 u& aSheet n. 3737 b, D9 Z' S2 p8 m
Page 1 (1)# g9 X! b' N0 w% Z
Subject:. v8 L2 E2 ^+ I- W2 ]/ s
Humidity conditioning9 ~( z N4 \* u& y8 @1 s
Key words:
8 H4 n; c, g- C" T# W; H-Insulation
3 L. u- L6 p5 P. P+ l4 F8 E) y-Humidity' D; G l: t O! f0 U% r: L
Decision confirmed
) v& m* }3 `, B& }at CTL 38th meeting6 A f( G! f1 n' t8 Q
Question:0 i' i6 P0 B/ c3 s8 A* f6 r; z, y! N
Sub-clause 2.9.1 specifies that " the component or subassembly" be subjected to the
" c0 u) n' V5 }' Q* \) Dhumidity treatment of 2.9.2. Sub-clause 2.9.2 specifies that " during the conditioning the
% }4 X c) B8 z/ h0 q3 B; {3 Kcomponent or subassembly is not energized".
7 y7 j, @- F2 u P5 UCan these requirements be interpreted in the way that only components and subassemblies* [! z! P- \* ], x- d
need to be subjected to the conditioning and not the equipment where these components+ ^0 E* W' f; D( O
and/or subassemblies are mounted?+ b3 V* f% q j' u
Decision:
, u$ ?& H1 S2 d3 G8 u$ O% |, WYes.
4 ]) ]/ n% c+ @8 E# z3 Z! A8 E
i: D0 `, t H5 f5 a1 [, G; O6 r
( }0 f+ a) V& |4 n: I$ i1 h& l7 u' U- S4 t
0 G& ?+ t" R- ^/ J" Y+ O5 v' T2 b3 ^8 f
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发表于 2012-11-6 17:52
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