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以下我觉得描述比较正. O; ?+ G4 A: Y
Enclosure, inner surface, near T2, V4 l& ?! t2 B! Y; u! z
Enclosure, inner surface, near Q1
% [! z, [: i- ~6 f2 S- M D; i6 XEnclosure, inner surface, near BR1
) s% l( h$ S: j6 N. P6 DDiffuser Cover, nearest to heatsink; M# y. {8 w) O+ U6 [1 l U& m) m& H* Z
Diffuser, inside, near LED
/ F# l% |& @2 ~% Q: AInput lead, near L1
0 Q+ J4 Q& T: w% C0 b! LOutput lead, near to LED / T22 T: L- Y7 j8 d8 r$ k/ u& V
Connector, near LED. j! C9 x7 G$ j% V
LED board, near center LED7 q) n8 C# i$ r! ^7 d' Z, T0 ~
PWB foil trace side
& [& N% n' z" ]6 NT1 winding4 A9 M% h8 s. J" E6 H
L1 winding2 t% [* B9 o/ B5 n
L3 winding, R, D! T0 b7 c( f2 ^% k# t; i$ _2 q
IC1
/ C F" ?3 h( V( n' {Capacitor CX2
) S$ i B' X( ^/ K; ^6 HCapacitor CY1& E" W0 K9 r- ?8 I
Capacitor CY22 l7 o+ q/ A! C# s* ^
Insulation, contact heatsink2 m% u/ |7 ?+ P- u/ Q! d5 {1 q
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