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以下我觉得描述比较正
" a& T, n, ?" w5 H {4 MEnclosure, inner surface, near T2' ]# }5 ~% y. W( q6 [/ G% U
Enclosure, inner surface, near Q1& K( u; _% m! C1 A; R+ c& T
Enclosure, inner surface, near BR10 h8 e1 p7 W0 n) N' l2 B% u
Diffuser Cover, nearest to heatsink) P$ C8 L4 e" N9 ~( k6 N4 c, A
Diffuser, inside, near LED
$ v8 s" z t5 ]! M) t* `/ ^7 h) CInput lead, near L1
" Q# q3 P+ c, l% J0 LOutput lead, near to LED / T25 d) B7 L$ u! r7 ?8 W
Connector, near LED
, C3 r7 l( X0 j: gLED board, near center LED3 E: J* O4 q) O* G
PWB foil trace side
7 G. w- \9 j1 A- s" uT1 winding
6 `# f! \- t# s! R5 fL1 winding6 s9 @0 F, _- J) d$ Q7 s
L3 winding. @* p3 C2 x: ~& s/ J0 r2 O) }
IC1
! ^1 k- Y5 A& A, ^) NCapacitor CX2
( q: f8 o2 B, G O+ V: j* K+ O8 d& p2 |Capacitor CY17 K# S1 m. L. V3 n8 C2 y( }/ [- p. Z
Capacitor CY2
6 w- M& ]2 H: a8 E. k/ cInsulation, contact heatsink
2 S! p1 l8 S- r4 w9 w8 K& W9 b: O |
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