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| DSH 3804 `+ G0 t/ S6 D9 G( r
/ k' j2 ~& |. T& ^, d# ?1 d | Affect of solder resist on Comparative Tracking Index (CTI) of Printed Wiring Boards
7 v$ `) q: T. n; r2 V, l' C+ O; U | 2.9.3, Table 6, Condition 3
% \8 U" f+ A: d( `3 F | 60950(ed.2) & 60950(ed.3): M# R4 ?. p0 h y5 G, O
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2 Y. l7 [7 J4 O2 }+ Y0 l, ^$ S1 @Standard:" g# R- t. g6 {5 O
IEC 60950, 2nd and 3rd Ed.) q9 `; p! E; J( \: K: m
Sub clause:
* q& J" W$ \: v& L7 V6 @8 ~! Y7 @2.9.3, Table 6, condition 3
1 I9 ~/ D j; q! {# Q4 i0 G8 TSheet n. 380
( z/ A# R V1 `, l- p- tPage 1 (1)3 b' q/ F5 ^8 @& ~7 c
Subject:% `+ @2 T, V# `+ m, d/ \
Affect of solder resist on
3 Y& p( f1 q+ ]) I; F5 |5 u$ J1 mComparative Tracking Index (CTI)
; \, k' `. c. }of Printed Wiring Boards
9 y( ^4 q3 A {6 X* ]$ Z& nKey words:+ |' H+ X* w9 m k3 V, r6 p
-comparative tracking index% _' c* m0 H1 k: }. W4 b" ^
-CTI
- X. \9 @3 V% f& ?-printed wiring boards5 b5 h7 K- \4 P8 ~3 s3 V
-PWB ^6 {% F& }, A2 l" b9 O
-solder resist
4 x8 f" Q! y1 |3 _+ T1 a4 @; [. yDecision confirmed+ v' F; ?% f6 O. p
at CTL 38th meeting
# A" \# x4 d3 r$ L$ K. a ~2 {Question:" N# [/ M, V) I3 V' w* ], _4 i2 ^
The measured Comparative Tracking Index (CTI) for a printed wiring board with solder& K/ m ~- v9 f. L8 \# y8 y1 T5 a
resist present can be different than that for the printed wiring board without the solder resist.
3 q4 p: o) ]; s: F$ N x7 @+ z' DThe creepage distances required in the standard depends upon the CTI for the printed wiring
* }; [8 R' g1 I: \# o3 r* Dboard.
! i& V R$ { Q3 H; aShould the presence of solder resist on a printed wiring board be considered in determining7 ?) m& o& r9 A& x0 h" _- x: W
the CTI when determining the creepage distances requirements to be applied?
7 A2 q2 c4 ]+ Z& E$ ]4 DNote – Clause 2.9.5 does not apply to this question because the assembled printed wiring
7 b6 ?2 @4 O% f$ X4 k8 Mboard is not covered with a conformal coating.$ f1 Q" g' i6 ?3 j4 c% t$ _
Decision:4 B6 y, z* g. N% C0 \0 ?
Yes.7 U+ O) F# Z6 u
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