DSH 380 Affect of solder resist on Comparative Tracking Index (CTI) of Printed

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DSH 380 / \4 t3 ?1 x' l% k" r$ P+ F

Affect of solder resist on Comparative Tracking Index (CTI) of Printed Wiring Boards

2.9.3, Table 6, Condition 3 + Y, T5 x- X+ R; V. O

60950(ed.2) & 60950(ed.3)

- p' j: r5 @. q* QStandard:
0 {% ~7 E8 E( q9 A6 cIEC 60950, 2nd and 3rd Ed.
# P4 _/ a0 |; w4 U6 K% KSub clause:
+ {4 ~- t) T3 ^0 ^; O. W9 a2.9.3, Table 6, condition 3
5 i* Y2 u' p/ U/ _* \3 RSheet n. 380
" K: q" Q$ F4 C. G4 b2 H7 D3 BPage 1 (1)
Subject:
Affect of solder resist on
" o8 t( p/ @5 `4 }! A; `! OComparative Tracking Index (CTI)
8 e* `# w% P9 d  [5 L' }of Printed Wiring Boards
' T% ?$ I4 t8 a. i3 vKey words:
-comparative tracking index
-CTI
-printed wiring boards
' E' M. M4 Z  f# d# }. {- M/ i1 s-PWB
# t* J1 x& S) x# _2 `/ U* m, B-solder resist
Decision confirmed
9 r9 P& }# M, P# n# bat CTL 38th meeting
4 h$ P* R4 z7 z% jQuestion:
The measured Comparative Tracking Index (CTI) for a printed wiring board with solder
resist present can be different than that for the printed wiring board without the solder resist.
The creepage distances required in the standard depends upon the CTI for the printed wiring
board.
# d5 ^, q1 }3 x' z1 T5 g0 eShould the presence of solder resist on a printed wiring board be considered in determining
: N3 p$ y: Y7 l& P; sthe CTI when determining the creepage distances requirements to be applied?
Note – Clause 2.9.5 does not apply to this question because the assembled printed wiring
board is not covered with a conformal coating.
Decision:
' N5 Q( e2 {. |; [( z  }4 nYes.
/ A5 M. a' K! a4 ~2 y- J$ Q; ^